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1/12 october 2002 stp12nm50 - stp12nm50fp stb12nm50 - stb12nm50-1 n-channel 500v - 0.30 w - 12a to-220/fp/d 2 pak/i 2 pak mdmesh?power mosfet (1)i sd 12 a, di/dt 400 a/s, v dd v (br)dss , t j t jmax. (*)limited only by maximum temperature allowed n typical r ds (on) = 0.30 w n high dv/dt and avalanche capabilities n 100% avalanche tested n low input capacitance and gate charge n low gate input resistance n tight process control and high manufacturing yields description the mdmesh ? is a new revolutionary mosfet tech- nology that associates the multiple drain process with the companys powermesh? horizontal layout. the resulting product has an outstanding low on-resis- tance, impressively high dv/dt and excellent avalanche characteristics. the adoption of the companys propri- etary strip technique yields overall dynamic perfor- mance that is significantly better than that of similar competitions products. applications the mdmesh? family is very suitable for increasing power density of high voltage converters allowing sys- tem miniaturization and higher efficiencies. absolute maximum ratings (?)pulse width limited by safe operating area type v dss r ds(on) i d stp12nm50/fp stb12nm50 stb12nm50-1 500v 500v 500v <0.35 w <0.35 w <0.35 w 12 a 12 a 12 a symbol parameter value unit stp(b)12nm50(-1) stp12nm50fp v ds drain-source voltage (v gs = 0) 500 v v dgr drain-gate voltage (r gs = 20 k w ) 500 v v gs gate- source voltage 30 v i d drain current (continuous) at t c = 25c 12 12(*) a i d drain current (continuous) at t c = 100c 7.5 7.5(*) a i dm ( l ) drain current (pulsed) 48 48(*) a p tot total dissipation at t c = 25c 160 35 w derating factor 1.28 0.28 w/c dv/dt(1) peak diode recovery voltage slope 15 v/ns v iso insulation winthstand voltage (dc) -- 2500 v t stg storage temperature C65 to 150 c t j max. operating junction temperature 150 c to-220 1 2 3 to-220fp 1 2 3 i 2 pak (tabless to-220) 1 3 d 2 pa k i nternal schematic diagram
stp12nm50 - stp12nm50fp - stb12nm50 - stb12nm50-1 2/12 thermal data avalanche characteristics electrical characteristics (t case = 25 c unless otherwise specified) off on (1) dynamic 1. pulsed: pulse duration = 300 s, duty cycle 1.5 %. 2. c oss eq. is defined as a constant equivalent capacitance giving the same charging time as c oss when v ds increases from 0 to 80% v dss . to-220 /d 2 pak/ i 2 pak to-220fp rthj-case thermal resistance junction-case max 0.78 3.57 c/w rthj-amb t l thermal resistance junction-ambient max maximum lead temperature for soldering purpose 62.5 300 c/w c symbol parameter max value unit i ar avalanche current, repetitive or not-repetitive (pulse width limited by t j max) 6a e as single pulse avalanche energy (starting t j = 25 c, i d = i ar , v dd = 50 v) 400 mj symbol parameter test conditions min. typ. max. unit v (br)dss drain-source breakdown voltage i d = 250 a, v gs = 0 500 v i dss zero gate voltage drain current (v gs = 0) v ds = max rating v ds = max rating, t c = 125 c 1 10 a a i gss gate-body leakage current (v ds = 0) v gs = 30v 100 na symbol parameter test conditions min. typ. max. unit v gs(th) gate threshold voltage v ds = v gs , i d = 250 a 345v r ds(on) static drain-source on resistance v gs = 10 v, i d = 6 a 0.30 0.35 w symbol parameter test conditions min. typ. max. unit g fs (1) forward transconductance v ds > i d(on) x r ds(on)max, i d =6a 5.2 s c iss input capacitance v ds = 25v, f = 1 mhz, v gs = 0 1000 pf c oss output capacitance 180 pf c rss reverse transfer capacitance 25 pf c oss eq. (2) equivalent output capacitance v gs = 0v, v ds = 0v to 400v 90 pf r g gate input resistance f=1 mhz gate dc bias=0 test signal level=20mv open drain 1.6 w
3/12 stp12nm50 - stp12nm50fp - stb12nm50 - stb12nm50-1 safe operating area for to-220fp safe operating area for to-220 / d2pak/i2pak electrical characteristics (continued) switching on switching off source drain diode note: 1. pulsed: pulse duration = 300 s, duty cycle 1.5 %. 2. pulse width limited by safe operating area. symbol parameter test conditions min. typ. max. unit t d(on) turn-on delay time v dd = 250 v, i d = 6 a r g = 4.7 w v gs = 10 v (see test circuit, figure 3) 20 ns t r rise time 10 ns q g total gate charge v dd = 400 v, i d = 12 a, v gs = 10 v 28 nc q gs gate-source charge 8 nc q gd gate-drain charge 15 nc symbol parameter test conditions min. typ. max. unit t r(voff) off-voltage rise time v dd = 400 v, i d = 12 a, r g =4.7 w, v gs = 10 v (see test circuit, figure 5) 19 ns t f fall time 8 ns t c cross-over time 18 ns symbol parameter test conditions min. typ. max. unit i sd i sdm (2) source-drain current source-drain current (pulsed) 12 48 a a v sd (1) forward on voltage i sd = 12 a, v gs = 0 1.5 v t rr q rr i rrm reverse recovery time reverse recovery charge reverse recovery current i sd = 12 a, di/dt = 100 a/s, v dd = 100 v, t j = 25c (see test circuit, figure 5) 270 2.23 16.5 ns c a t rr q rr i rrm reverse recovery time reverse recovery charge reverse recovery current i sd = 12 a, di/dt = 100 a/s, v dd = 100 v, t j = 150c (see test circuit, figure 5) 340 3 18 ns c a
stp12nm50 - stp12nm50fp - stb12nm50 - stb12nm50-1 4/12 thermal impedance for to-220 /d2pak/ i2pak output characteristics static drain-source on resistance thermal impedance for to-220fp transfer characteristics transconductance
5/12 stp12nm50 - stp12nm50fp - stb12nm50 - stb12nm50-1 gate charge vs gate-source voltage capacitance variations normalized gate threshold voltage vs temperature normalized on resistance vs temperature source-drain diode forward characteristics
stp12nm50 - stp12nm50fp - stb12nm50 - stb12nm50-1 6/12 fig. 5: test circuit for inductive load switching and diode recovery times fig. 4: gate charge test circuit fig. 2: unclamped inductive waveform fig. 1: unclamped inductive load test circuit fig. 3: switching times test circuits for resistive load
7/12 stp12nm50 - stp12nm50fp - stb12nm50 - stb12nm50-1 dim. mm inch min. typ. max. min. typ. max. a 4.40 4.60 0.173 0.181 c 1.23 1.32 0.048 0.051 d 2.40 2.72 0.094 0.107 d1 1.27 0.050 e 0.49 0.70 0.019 0.027 f 0.61 0.88 0.024 0.034 f1 1.14 1.70 0.044 0.067 f2 1.14 1.70 0.044 0.067 g 4.95 5.15 0.194 0.203 g1 2.4 2.7 0.094 0.106 h2 10.0 10.40 0.393 0.409 l2 16.4 0.645 l4 13.0 14.0 0.511 0.551 l5 2.65 2.95 0.104 0.116 l6 15.25 15.75 0.600 0.620 l7 6.2 6.6 0.244 0.260 l9 3.5 3.93 0.137 0.154 dia. 3.75 3.85 0.147 0.151 l6 a c d e d1 f g l7 l2 dia. f1 l5 l4 h2 l9 f2 g1 to-220 mechanical data p011c
stp12nm50 - stp12nm50fp - stb12nm50 - stb12nm50-1 8/12 dim. mm inch min. typ. max. min. typ. max. a 4.4 4.6 0.173 0.181 b 2.5 2.7 0.098 0.106 d 2.5 2.75 0.098 0.108 e 0.45 0.7 0.017 0.027 f 0.75 1 0.030 0.039 f1 1.15 1.7 0.045 0.067 f2 1.15 1.7 0.045 0.067 g 4.95 5.2 0.195 0.204 g1 2.4 2.7 0.094 0.106 h 10 10.4 0.393 0.409 l2 16 0.630 l3 28.6 30.6 1.126 1.204 l4 9.8 10.6 0.385 0.417 l6 15.9 16.4 0.626 0.645 l7 9 9.3 0.354 0.366 ? 3 3.2 0.118 0.126 l2 a b d e h g l6 f l3 g1 123 f2 f1 l7 l4 to-220fp mechanical data
9/12 stp12nm50 - stp12nm50fp - stb12nm50 - stb12nm50-1 dim. mm inch min. typ. max. min. typ. max. a 4.4 4.6 0.173 0.181 a1 2.49 2.69 0.098 0.106 b 0.7 0.93 0.027 0.036 b2 1.14 1.7 0.044 0.067 c 0.45 0.6 0.017 0.023 c2 1.21 1.36 0.047 0.053 d 8.95 9.35 0.352 0.368 e 10 10.4 0.393 0.409 g 4.88 5.28 0.192 0.208 l 15 15.85 0.590 0.624 l2 1.27 1.4 0.050 0.055 l3 1.4 1.75 0.055 0.068 l2 l3 l b2 b g e a c2 d c a1 det ail "a" det ail "a" a2 p011p6/e to-263 (d 2 pak) mechanical data
stp12nm50 - stp12nm50fp - stb12nm50 - stb12nm50-1 10/12 dim. mm inch min. typ. max. min. typ. max. a 4.4 4.6 0.173 0.181 a1 2.49 2.69 0.098 0.106 b 0.7 0.93 0.027 0.036 b2 1.14 1.7 0.044 0.067 c 0.45 0.6 0.017 0.023 c2 1.23 1.36 0.048 0.053 d 8.95 9.35 0.352 0.368 e 2.4 2.7 0.094 0.106 e 10 10.4 0.393 0.409 l 13.1 13.6 0.515 0.531 l1 3.48 3.78 0.137 0.149 l2 1.27 1.4 0.050 0.055 l l1 b2 b d e a c2 c a1 l2 e p011p5/e to-262 (i 2 pak) mechanical data
11/12 stp12nm50 - stp12nm50fp - stb12nm50 - stb12nm50-1 tape and reel shipment (suffix t4)* tube shipment (no suffix)* d 2 pak footprint * on sales type dim. mm inch min. max. min. max. a 330 12.992 b 1.5 0.059 c 12.8 13.2 0.504 0.520 d 20.2 0795 g 24.4 26.4 0.960 1.039 n 100 3.937 t 30.4 1.197 base qty bulk qty 1000 1000 reel mechanical data dim. mm inch min. max. min. max. a0 10.5 10.7 0.413 0.421 b0 15.7 15.9 0.618 0.626 d 1.5 1.6 0.059 0.063 d1 1.59 1.61 0.062 0.063 e 1.65 1.85 0.065 0.073 f 11.4 11.6 0.449 0.456 k0 4.8 5.0 0.189 0.197 p0 3.9 4.1 0.153 0.161 p1 11.9 12.1 0.468 0.476 p2 1.9 2.1 0.075 0.082 r 50 1.574 t 0.25 0.35 0.0098 0.0137 w 23.7 24.3 0.933 0.956 tape mechanical data
stp12nm50 - stp12nm50fp - stb12nm50 - stb12nm50-1 12/12 information furnished is believed to be accurate and reliable. however, stmicroelectronics assumes no res ponsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result f rom its use. no license is granted by implication or otherwise under any patent or patent rights of stmicroelectronics. specificati ons mentioned in this publication are subject to change without notice. this publication supersedes and replaces all information previously supplied. stmicroelectronics products are not authorized for use as critical components in life support devi ces or systems without express written approval of stmicroelectronics. ? the st logo is a registered trademark of stmicroelectronics ? 2002 stmicroelectronics - printed in italy - all rights reserved stmicroelectronics group of companies australia - brazil - canada - china - finland - france - germany - hong kong - india - israel - italy - japan - malaysia - malt a - morocco singapore - spain - sweden - switzerland - united kingdom - united states. ? http://www.st.com

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